基于双曲正弦函数的拓扑优化在热传导结构设计中的应用

Application of Topology Optimization Based on sinh Function in the Design of Heat Conduction Structure

电子设备的热传导结构设计是解决飞机电子设备热防护问题的有效方法,基于经验的传统设计方法存在设计周期长,获得的结果性能并不一定优等问题,因此将拓扑优化应用在飞机电子设备散热设计中,能够快速获取较优的结构布局。建立基于双曲正弦函数(sinh函数)插值模型的热传导拓扑优化数学模型,将该模型的算法应用于二维、三维热传导算例,并通过MATLAB编程进行算法实现;该模型与SIMP模型和RAMP模型进行对比,并应用于机载LRM模块导热拓扑优化设计。结果表明:基于sinh函数的插值模型较SIMP插值模型精确,较RAMP插值模型的迭代次数少,能更好地解决热传导结构拓扑优化设计问题。

The heat conduction structure design of electronic equipment is an effective method to solve the thermal protection problem of aircraft electronic equipment.The experiential-based traditional design method has the problems of long design period,and can’t acquire the better results,so the topology optimization applied in thermal design of aircraft electronic device can acquire the fast better structure layout.The heat conduction topology optimization mathematic method based on hyperbolic sine function(sinh function)interpolation model is established.Its algorithm is applied to 2D and 3D heat conduction samples,and realized with MATLAB programming.The model is compared with SIMP model and RAMP model,and applied in conduction topology optimization design of onboard LRM module.The results show that the interpolation model based on sinh function is more accurate than SIMP interpolation model,and has fewer iterations than RAMP interpolation model,and can better solve the problem of topology optimization design of heat conduction structure.