摘要
采用扫描电镜(SEM)研究在150℃等温时效下Cu/Sn5Sb1Cu0.1Ni0.1Ag/Cu与Ni/Sn5Sb1Cu0.1Ni0.1Ag/Ni焊点的界面扩散行为.结果表明,在时效过程中,随着时效时间的增加,Cu/Sn5Sb1Cu0.1Ni0.1Ag/Cu焊点界面金属间化合物(intermetallic compound,IMC)形貌由开始的细针状生长为棒状,IMC层厚度增加,界面IMC主要成分为(Cu,Ni)6Sn5. Ni/Sn5Sb1Cu0.1Ni0.1Ag/Ni焊点的界面IMC形貌由细小突起状转变为较为密集颗粒状,且IMC层厚度增加,界面IMC主要成分为(Cu,Ni)3Sn4.经过线性拟合,两种焊点的界面IMC层生长厚度与时效时间t1/2呈线性关系,Sn5Sb1Cu0.1Ni0.1Ag/Cu界面间IMC的生长速率为7.39×10^-2μm^2/h,Sn5Sb1Cu0.1Ni0.1Ag/Ni界面间IMC的生长速率为2.06×10^-2μm^2/h.镀镍层的加入可以显著改变界面IMC的形貌,也可降低界面IMC的生长速率,抑制界面IMC的生长,显著提高抗时效性能.
In this paper,SEM was used to study the interfacial diffusion behavior of Cu/Sn5Sb1Cu0.1Ni0.1Ag/Cu and Ni/Sn5Sb1Cu0.1Ni0.1Ag/Ni solder joints under isothermal aging at 150℃.The results showed that the morphology of intermetallic compound(IMC)at Cu/Sn5Sb1 Cu0.1Ni0.1Ag/Cu solder joint grew from thin needle-shaped to rod-shaped and the thickness of IMC increased with aging time increasing.The main composition of IMC was(Cu,Ni)6Sn5.The appearance of IMC at Ni/Sn5Sb1Cu0.1 Ni0.1Ag/Ni solder joints changed from horst shaped to relatively granular shaped,and the thickness of IMC increased.The main composition of IMC was(Cu,Ni)3Sn4.The growth rate of IMC at interface of Sn5Sb1Cu0.1Ni0.1Ag/Cu solder joint was 7.39×10^−2μm^2/h,and that at interface of Sn5Sb1 Cu0.1Ni0.1Ag/Ni was 2.06×10^−2μm^2/h.Nickel-plating significantly changed the morphology of IMC,reduced the growth rate of IMC,inhibited the growth of IMC,and significantly improved the aging resistance.
作者
孙凤莲
李天慧
韩帮耀
SUN Fenglian;LI Tianhui;HAN Bangyao(Harbin University of Science and Technology,Harbin,150040,China)
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2020年第2期28-32,I0006,共6页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51174069)。
