锥束CT在电子元器件方面的应用

Application of Cone Beam CT in Electronic Components

锥束CT相比较DR和断层扫描,具有检测精度高,检测效率高的优势。不但可以对工业零部件进行无损检测,发现零件内部缺陷信息,还可以对电子元器件进行失效分析。使用高分辨率微焦点锥束CT扫描技术可以针对电路板、以及芯片等重要电子元器件进行二维、三维成像分析,可以直观了解电子器件内部结构及线路分布情况,对于重要电路板还原可以进行逆向分析,分析出电路板线路图,还原制版图,帮助企业吸收已有的科技成果。

Compared with DR and tomography,cone-beam CT has the advantages of high detection accuracy and high detection efficiency.Not only can non-destructive testing be performed on industrial parts,to find internal defect information of parts,but also failure analysis of electronic components.The use of high-resolution microfocus cone-beam CT scanning technology can perform two-dimensional and three-dimensional imaging analysis on important electronic components such as circuit boards and chips,and can intuitively understand the internal structure and circuit distribution of electronic devices.Reverse analysis,analyze the circuit board circuit diagram,restore the layout,to help companies absorb existing scientific and technological achievements.