近阴极周向平动搅拌式平面电铸均匀性研究

Study on uniformity of coating electroformed from an electrolyte stirred by circumferential translation of a plate near the cathode

提出一种近阴极周向平动搅拌式电铸技术,通过数值仿真分析了搅拌板的周向平动半径(R)及其与阴极面的距离(h)对近阴极面液流层分布特性的影响,并开展了工艺验证试验。结果表明:搅拌板的周向平动运动参数对电铸层厚度均匀性有显著影响。在优化的条件(h=1.5 mm,R=10 mm,平动周期T=4 s)下所得电铸层(面积为150 mm×150 mm)的厚度约为75μm,均匀性达91.5%,不过边缘区的电铸层偏厚。数值仿真所得的电铸层厚度分布影响规律与316不锈钢表面电铸镍的实验结果基本一致。

An electroforming technology with stirring caused by the circumferential translation of a plate near the cathode was proposed.The effect of the radius(R)of circumferential translational motion for stirring plate and its distance(h)from cathode surface on the liquid flow layer distribution near cathode surface was analyzed through numerical simulation.The results showed that the circumferential translational motion parameters of stirring plate had a significant influence on the thickness uniformity of electroformed coating.The coating electroformed in an area of 150 mm×150 mm under the optimized parameters(h=1.5 mm,R=10 mm,translation period T=4 s)was about 75μm-thick with a thickness uniformity up to 91.5%.However,the coating at the edge is more thicker than other areas.The influence law of thickness distribution obtained by numerical simulation is basically consistent with the experimental results of electroforming nickel on 316 stainless steel surface.