摘要
Dendrite formation is a major obstacle, e.g., capacity loss and short circuit,to the next-generation high-energy-density lithium(Li)-metal batteries. The development of successful Li dendrite mitigation strategies is impeded by an insu?cient understanding in Li dendrite growth mechanisms. The Li-plating-induced internal stress in Li-metal and its e?ects on dendrite growth have been widely studied, but the underlying microcosmic mechanism is elusive. In the present study, the role of the plating-induced stress in dendrite formation is analyzed through ?rst-principles calculations and ab initio molecular dynamic(AIMD) simulations. It is shown that the deposited Li forms a stable atomic nano?lm structure on the copper(Cu) substrate, and the adsorption energy of Li atoms increases from the Li-Cu interface to the deposited Li surface, leading to more aggregated Li atoms at the interface. Compared with the pristine Li-metal, the deposited Li in the early stage becomes compacted and su?ers the in-plane compressive stress. Interestingly,there is a giant strain gradient distribution from the Li-Cu interface to the deposited Li surface, making the deposited atoms adjacent to the Cu surface tend to press upwards with perturbation and causing the dendrite growth. This provides an insight into the atomicscale origin of Li dendrite growth, and may be useful for suppressing the Li dendrite in Li-metal-based rechargeable batteries.
基金
the National Natural Science Foundation of China(Nos.11572040and 11521202)
the National Key Research and Development Program of China(No.2016YFB0700600)。