倒装芯片切割用胶粘材料的类型

Types of Adhesive Material for Cutting Flip Chip

面对小型化、薄型化的发展趋势,倒装芯片技术具有高密度安装的优势。倒装芯片是在所有表面安装技术中,可以达到最小、最薄的封装。倒装芯片切割用胶粘材料贯穿切割、拾取、封装多个步骤,是关键的辅助性材料。文章梳理了倒装芯片切割用胶粘材料的类型,包括单层胶粘材料和一体型薄膜,其中一体型薄膜依次包括背面保护膜、切割膜和基材,重点介绍胶粘材料的性能要求和应用发展。

Based on the development trend of miniaturization and thinness,flip chip technology has the advantage of high-density installation.Flip chip is the smallest and thinnest package of all surface mounting technologies.The adhesive material for flip chip cutting is the key auxiliary material,which runs through many steps of cutting,picking and packaging.In this paper,the types of adhesive materials used for cutting flip chip are reviewed,including single-layer adhesive materials and one-piece f ilms.One-piece f ilms include back protective f ilm,cutting f ilm and substrate in turn.The performance requirements and application development of adhesive materials are mainly introduced.