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超声振动抛光中材料去除原理与力学分析 被引量:1

Principle and Mechanical Analysis of Material Removal in Ultrasonic Vibration Polishing
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摘要 根据超声振动抛光原理分析了弹塑性材料抛光过程中的材料去除方式;建立了弹塑性材料的材料去除模型,给出了磨粒速度、冲击载荷和工件表面受力变形的数学表达式;分析讨论了抛光过程和抛光参数的影响并用已有实验验证了该模型的合理性。 In terms of the principle of ultrasonic vibration polishing,the material removal method in the elastoplastic material polishing process is analyzed.The material removal model for elastoplastic material is established,and the mathematical expressions of abrasive particle velocity,impact load and force on the surface of the workpiece are given.The effects of the polishing processing parameters on the material removal were discussed and analyzed,and the rationality of the model was verified by using the existing experiments.
作者 冯应恒 刘润爱 郭文亮 Feng Yingheng;Liu Run'ai;Guo Wenliang(College of Mechanical and Vehicle Engineering,Taiyuan University of Technology,Taiyuan 030024,China)
出处 《机械科学与技术》 CSCD 北大核心 2020年第6期879-883,共5页 Mechanical Science and Technology for Aerospace Engineering
基金 国家重点研发计划项目(2018YFB1308700)资助。
关键词 超声振动抛光 弹塑性材料 材料去除模型 ultrasonic vibration polishing elastoplastic material material removal model
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