摘要
盲孔裂纹是高密度互连(HDI)印制电路板的可靠性问题之一。文章结合生产实例,利用金相切片、扫描电镜、能谱分析,以及现场调查和试验等分析手段,对导致HDI板盲孔裂纹的原因进行了系统研究和分析,并提出了一些改善措施。
Blind hole cracks is one of the common defects of the high density Interconnect(HDI)board.Combining production practice,this article studied and analyzed the blind hole cracks of the HDI boards by means of micro-section,SEM,EDX,field investigation and test,etc.Some improvements were then put forward.
作者
戴勇
刘红刚
张华勇
寻瑞平
Dai Yong;Liu Honggang;Zhang Huayong;Xun Ruiping(Jiangmen Suntak Circuit Technology Co.,Ltd.,Guangdong Intelligent Industrial Control PCB Engineering and Technology Research and Development Center,Jiangmen 529000,Guangdong,China)
出处
《印制电路信息》
2020年第7期1-5,共5页
Printed Circuit Information
