印制电路板生产中碱性蚀刻点状凹坑改善

Improvement of alkalinity etched pits in PCB production

镀锡气泡、不同的干膜、光剂对铜缸的有机污染、均会导致线路板蚀刻后点状凹坑不良,通过提高锡缸过滤排气量和调整震动时间优化、并采用抗污性干膜/光剂等方面,均可以改善点状凹坑不良。

TTin-plated bubbles,different dry films,and organic contamination of copper cylinders can cause poor pit-like pits after etching the circuit board.Optimize the time of the tin cylinder and adjust the vibration time and use stained dry film/light agent can improve the defect of the pit.