基于铜粉改性的液态金属热界面材料导热性能实验

Experimental Study on Thermal Conductivity of Low Melting Temperature Alloys Thermal Interface Materials Based on Copper Powder Modification

为强化液态金属作为热界面材料的导热性能,同时降低液态金属的流动性,本文制作了一种以液态金属Ga62.5In21.5 Sn16为基体,分别掺杂有0.5μm、5μm、50μm铜粉的热界面材料,并通过制作铜片-热界面材料-铜片(Cu-TIM-Cu)、铝片-热界面材料-铝片(Al-TIM-Al)两种三层试样,采用基于稳态的接触热阻测量方法对试样在0.05MPa、0.1 MPa、0.15 MPa、0.2 MPa、0.4 MPa、0.6 MPa压力下的接触热阻进行测量。结果表明,相同压力下,两种试样掺杂0.5μm铜粉后均能很大程度上降低固固界面之间的接触热阻,相比直接填充液态金属,铜试样的接触热阻分别减小了46.3%、47.9%、58.6%、66.9%、72.3%、69.8%,铝试样分别减小了31.7%、33.1%、32.9%、36.7%、32.4%、33.3%。而且,随着掺杂铜粉粒径的减小,液态金属热界面材料的导热性能逐渐增强;随着施加压力的增加,界面接触热阻呈逐渐减小的趋势。

In order to further strengthen the thermal conductivity of low melting temperature alloys(LMA)as a thermal interface material(TIM)and reduce the fluidity of low melting temperature alloys.In this paper,a thermal interface material with low melting temperature alloys Ga62.5In21.5Sn16as the matrix and doped with 0.5μm,5μm and 50μm copper powder was fabricated.And made two kinds of three-layer samples of copper-thermal interface material-copper(Cu-TIM-Cu),aluminum-thermal interface material-aluminum(Al-TIM-Al).The thermal contact resistance of the samples at pressures of 0.05 MPa,0.1 MPa,0.15 MPa,0.2 MPa,0.4 MPa,and 0.6 MPa was measured based on the steady state method.The results show that under the same pressure,the doping of 0.5μm copper powder on both samples can greatly reduce the thermal contact resistance between the solid-solid interfaces.Compared with the direct filling of low melting temperature alloys,the thermal contact resistance of the copper samples were decreased by 46.3%,47.9%,58.6%,66.9%,72.3%,69.8%,and the aluminum samples were reduced by 31.%,33.1%,32.9%,36.7%,32.4%,33.3%,respectively.Moreover,as the particle size of the doped copper powder decreases,the thermal conductivity of the low melting temperature alloys thermal interface material gradually increases;As the applied pressure increases,the interface thermal contact resistance gradually decreases.