薄铜产品缺口开路改善

The defect of gap and opening improvement of the thin copper products

薄铜产品面铜极差要求±1μm,常规工艺达不到此要求。本司采用的露孔镀工艺,面铜不需加厚,可保证优秀的铜厚极差,但该工艺通孔孔口会产生25~30μm的凸台,导致图形后凸台区域的线路批量缺口开路。文章通过对比不同干膜,不同贴膜方向以及设计上进行优化等方式,解决了此类缺口开路报废。

The PCB boards with thin Cu thickness require the tolerance of Cu thickness limit in±1μm.Conventional process technology can’t meet the quality,but there is a new process technology with hole plating only and without plating board surface when rinsing in electroplating solutions which has greatly advantage in the fields.However,there are some disadvantages of the Lou hole plating technology,for example,the Cu thickness difference between the hole sides and the surface can reach to 25-30μm which may result in line open.In this paper,by comparing different dry films,different film lamination directions and design optimization,this kind of defect scrap rate is reduced.