气隔型刚挠结合板结构研究

Study of Rigid-Flex PCB with air gap structure

刚挠结合板兼备了普通HDI板和挠性板的优点,已被广泛应用于航天技术、医疗设备以及消费类等高端电子产品中。刚挠结合板气隔(Air Gap)设计,挠性层与挠性层之间需走捞空设计进行压合,对其进行相关的可靠性实验。研究结果表明,刚挠结合中软板气隔设计满足品质要求,对多层挠性板发展应用起到了很大促进作用。

The combination of rigid and flex board owns the advantages of common HDI board and flex board,and has been widely used in aerospace technology,medical equipment,consumer and other high-end electronic products.Because of the air gap design of the rigid and flex board,the rigid and flex boards need to be pressed by the bailing out design,and the relevant reliability experiments are carried out.The research results show that the design of air gap meets the quality requirements,which greatly promotes the development and application of multiple soft boards.