IGBT模块材料选型的仿真研究

Simulation Research on Material Selection of IGBT Module

作为电力电子变换器的核心器件,IGBT功率模块的可靠性是目前学术界和工业界关注的重点。本文借助有限元分析软件,根据IGBT模块的实际结构,构建了IGBT模块的电-热-力仿真模型。针对目前IGBT模块键合线失效的难题,研究了不同键合线材料与表面金属化层材料的选型对模块温度云图及应力云图的影响。仿真结果表明键合线材料的选型与模块内部的温度分布具有较强的相关性,金属化层材料的选型与模块内部的应力分布具有较强的相关性。因此,通过合理选择模块表面金属化层与键合线材料类型能极大程度降低模块内部的温度和应力,进而降低键合线失效的风险,提高模块的可靠性。

As the core device of power electronic converter,the reliability of IGBT power modules is currently the focus of academic and industrial circles.In this paper,based on the actual structure of IGBT module,an electrical-thermal-mechanical simulation model of IGBT module is constructed by means of finite element analysis software.Aiming at the problem of IGBT module bond wire failure,the effects of different bond wire materials and surface metallized layer materials on temperature and stress nephograms of IGBT module are researched.The simulation results show that there is a strong correlation between the selection of bond wire material and the temperature distribution inside the module,and the selection of metallized layer material has a strong correlation with the stress distribution inside the module.Therefore,the temperature and stress in the module can be greatly reduced by reasonably choosing the type of metallized layer material and the bond wire material,thereby it also can reduce the risk of bond line failure and improve the reliability of the module.