摘要
针对传统的接触式测试会对电子元器件造成损坏,且无法实现对球栅阵列(ball grid array,简称BGA)封装器件缺陷的识别,提出一种基于耦合宽边带状线理论的非接触测试结构,实现BGA焊点裂纹故障的非接触测试。依据测试结构中的攻击线与BGA焊点连接的受害线之间的耦合原理,针对待测试的BGA焊点结构建立非接触测试结构,提取等效参数并建立等效电路模型。在攻击线源端施加激励信号,通过分析攻击线远端电压与源端电压的比值随频率的变化规律,测得裂纹故障的谐振频率大于无故障的谐振频率。仿真实验结果表明,该方法可实现对BGA焊点裂纹故障的非接触测试。
Traditional contact test method can cause damage to electronic components and fail to identify defects in ball grid array(BGA) package components. A test model is proposed based on the broadside-coupled striplines, to achieve the purpose of contactless testing of the BGA crack fault. According to the coupling principle between the attack line in the test structure and the victim line connected with the BGA solder joint, the non-contact test structure was established for the BGA solder joint structure to be tested, and the equivalent parameters were extracted and the equivalent circuit model was established. By applying excitation signal at the source end of the attack line and analyzing the changing rule of the ratio of the voltage at the far end of the attack line to the voltage at the source end with the frequency, it is found that the resonance frequency measured during the crack fault is larger than that in the absence of fault. Experimental results show that this method can be used to test the crack fault of BGA solder joint.
作者
杨哲
尚玉玲
YANG Zhe;SHANG Yuling(School of Electronic Engineering and Automation,Guilin University of Electronic Technology,Guilin 541004,China)
出处
《桂林电子科技大学学报》
2020年第2期113-117,共5页
Journal of Guilin University of Electronic Technology
基金
国家自然科学基金(61661013)
广西自然科学基金(2018GXNSFAA281327)。