基于边缘线性拟合的芯片亚像素定位算法

Chip Sub-pixel Localization Algorithm Based on Edge Linear Fitting

为解决贴片机由于贴片元件中心定位精度不够导致贴片过程中可能出现的抛料、贴片芯片引脚损坏等情况,本文设计一种基于边缘数据拟合的贴片芯片中心定位算法,实现了对贴片芯片中心的亚像素级高精度定位。并在此基础上,利用检测出来的中心坐标计算出芯片离吸嘴的基准偏差,得到芯片的中心偏移量。并且通过线性拟合得到的边缘线,计算出芯片的旋转角。在算法过程中加入了去倒角算法去除倒角信息对拟合的影响,更好地提高检测结果的稳定性。由程序运行结果可知该算法提高了贴片机的贴片精度,特别对检测芯片偏转角度有着良好的效果,同时相对其他亚像素检测算法保证了检测过程的效率。

In order to solve the problem that the placement machine may not be caused by the centering accuracy of the chip component,the throwing of the chip and the pin of the chip may be damaged.In this paper,a center localization algorithm based on edge data fitting is designed to achieve high-precision sub-pixel positioning of the chip center.Based on this,the measured center deviation is used to calculate the reference deviation of the chip from the nozzle,obtain the center offset of the chip.And calculate the rotation angle of the chip by linearly fitting the obtained edge line.In the algorithm process,the de-chamfering algorithm is added to remove the influence of chamfering information on the fitting,and the stability of the detection result is better improved.It can be seen from the running results of the program that the algorithm improves the placement accuracy of the placement machine,and has a good effect on detecting the deflection angle of the chip,and the efficiency of the detection process is ensured compared with other sub-pixel detection algorithms.