摘要
电镀镀液对镀层均匀性及镀层厚度的影响展开分析,采用数值模拟的方法,模拟电镀镀液中电流密度的变化,以及变化的电流密度对镀层厚度变化的影响情况展开计算,再通过实验取样后SEM电镜扫描观察样品微观组织的变化,进一步验证模拟结果。通过这个过程,找出影响镀层厚度及镀层均匀性的主要影响因素,以期为电镀工作提供研究思路及发展方向。
The effect of electroplating bath on the uniformity and thickness of the coating was analyzed.The change of current density in electroplating bath and the effect of changing current density on coating thickness were calculated by numerical simulation method.After the experiment sampling SEM the microstructure of the sample was observed by electron microscope scanning to further verify the simulation results.Through this process,the main influencing factors of coating thickness and coating uniformity are found out,in order to provide research ideas and development direction for electroplating work.
作者
李虎
周光波
Li Hu;Zhou Guangbo(Chongqing Sound Optoelectronics Co.,Ltd.,China Electric Technology Group,Chongqing,400000)
出处
《当代化工研究》
2020年第13期155-156,共2页
Modern Chemical Research
关键词
电镀镀液
镀层均匀性
镀层厚度
液位
数值模拟
plating bath
coating uniformity
coating thickness
liquid level
numerical simulation
