基于平移拾取分选机双列直插封装集成电路测试可行性设计

The Feasibility Design of DIP IC Test Based on Pick&Place Automatic Separator

Pick&Place自动测试分选机是一种以平移拾取放置为基础的宽温度范围(高温、常温和低温)真空方式吸取电路测试分选机,依靠机械丝杆和磁悬浮传动臂的水平移动吸取电路和垂直移动压测完成整个测试流程。双列直插式封装(Dual In-line Package,简称DIP)电路是指用双排列管脚直插形式封装的集成电路。军用集成电路测试需要在高温、常温和低温3种不同的温度环境中测试,以确保电路的可靠性。为了检测单位能在平移拾取分选机上实现大批量双列直插式封装集成电路尤其是大批量军用双列直插式封装集成电路的测试,通过对Pick&Place自动测试分选机和双列直插式封装集成电路原理结构的分析,结合其在实际使用中的问题提出了一种可以在Pick&Place上实现DIP封装测试的创新性解决方案。

The Pick&Place automatic test sorting machine is a wide temperature range(high temperature,normal temperature and low temperature)vacuum mode suction circuit test sorting machine based on translational pick placement,relying on horizontal mobile suction circuit and vertical moving pressure measurement of mechanical wire rod and magnetic levitation drive arm to complete the whole test flow.Dual In-line Package is an integrated circuit packaged in the form of a double-row pin.Military integrated circuit testing requires three different temperature environments:high temperature,normal temperature and low temperature to ensure the reliability of the circuit.In order to realize the large-volume DIP integrated circuit test on the translation pick-up separator,especially the large-batch military DIP integrated circuit test,this paper analyzes the principle structure of the automatic test separator and the DIP integrated circuit,and puts forward a solution to realize the innovative test of DIP package on the Pick&Place.