铜表面微结构化对惰性润湿和反应润湿的影响

Effect of Cu Surface Microcosmic Morphology on the Inert Wetting and Reactive Wetting

利用纳秒激光在铜基板表面构建不同线间距的网格以得到不同的表面粗糙度。以乙二醇/铜惰性润湿体系和锡/铜高温反应润湿体系为研究对象,采用改良座滴法研究了纳秒激光铜表面微结构化对惰性润湿和反应润湿的影响。结果表明,在不同类型的网格未出现液滴的不对称,惰性润湿符合Wenzel模型而反应润湿结果则偏离此模型,即在可润湿的体系中,粗糙度增加可促进惰性润湿铺展,但会恶化反应润湿铺展。高温下反应润湿偏离此模型可归因于毛细管结构的消失和粗糙表面的微凸结构阻止了三相线的移动,故粗糙度的增加未能促进润湿。

Nanosecond laser was used to construct meshes with different line spacing on the surface of copper substrate to create different surface roughness.The influence of nanosecond laser microstructure on inert wetting and reactive wetting of copper was studied by using modified sessile drop method.The results showed that the different types of meshes did not cause asymmetric droplet,and the inert wetting was consistent with Wenzel model,while the reactive wetting results deviated from the model.In the inert wettable system,as predicted by Wenzel model,the increased roughness would promote the final wettability.The deviation of reactive wetting can be attributed to the fact that the asperities of the rough surface prevents the triple line from moving,and thus the increase of the roughness does not promote the wettability.