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大功率整流器件的热阻测试

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摘要 本文针对多层压接式整流芯片进行热阻测试,并通过仿真模拟分析器件结构对热阻的影响。将高导热石墨烯薄膜用于芯片表面,可以将器件峰值温度减小降低近5℃。
作者 戴立新
出处 《电子技术与软件工程》 2020年第10期198-200,共3页 ELECTRONIC TECHNOLOGY & SOFTWARE ENGINEERING
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