低熔点In-Bi焊粉的液相分散法制备及其焊接性能研究

Fabrication of low melting point In-Bi solder powders using liquid phase dispersion method and its low temperature soldering properties

利用液相分散法,采用正交试验思想,以聚乙二醇400为分散剂,在最优工艺条件下制备了粒径均匀的球形In-Bi低熔点合金焊粉。利用扫描电镜、X射线衍射、DSC131差示扫描量热仪等分析手段对粉体进行表征,结果表明,粉体的中值粒径为30μm,熔点为71.6℃,粉体的物相组成为In和BiIn2。以Ag、Cu为基板探究In-Bi合金焊粉的低温焊接性能,结果显示,两种基板下界面IMC层的成分分别为AgIn2和Cu11In9。

Based on orthogonal experiment,the spherical In-Bi solder powders with low melting point and suitable particle size distribution have been prepared via liquid phase dispersion method using PEG400 as a dispersant,and characterized by scanning electron microscope(SEM),X-ray diffractometer(XRD)and DSC131 differential scanning calorimeter.It was found that the powder had a median particle size of 30μm.The melting point was 71.6℃,which was slightly lower than the original In-Bi alloy material,and the phase composition of the powder was In and BiIn2.The low-temperature soldering performance of In-Bi alloy solder powder was investigated using Ag and Cu as substrates.The results show that the composition of the interface IMC layer obtained from the Ag and Cu substrates was AgIn2 and Cu11In9,respectively.