提高热压导光板网点高度的研究

Research on the Improvement of the Pattern Height of the Rolling-stamping Light Guide Plate

讨论将热压导光板的网点高度从2.0μm提升到4.0μm,以应对薄化高端背光。使用两种研究方法:一是通过翻铸的方式或是最佳化激光与频率使得模仁上火山口高度提升而不崩塌;二是通过温度、热压速度与压力的调整将高网点滚轮有效地转写到导光板上。最终通过实验验证得出最佳激光P值为126 W,热压参数设置为155℃,速度4 000 cm·min^-1,压力3 000 N,此时可将钢板火山口高度提升至13.0μm,热压网点高度由2.0μm提升至4.0μm以上。

How to raise the pattern height of the hot-pressed light guide plate from 2.0 μm to 4.0μm was explored,in order to cope with the thinned high-end backlight. To achieve the purposes above,two parts need to be studied. Firstly,how to raise the height of the rolling-stamping patterns,which could be achieved through foundry casting or optimizing the laser power and frequency to raise the pattern height of the upper crater of the core of mold without collapse. The second was to effectively transfer the high dot roller to the guide through the adjustment of temperature,hot pressing speed and pressure Light board. In the conclusion,the optimal laser P value was verified to be 126 W,the hot-pressure parameter 155 ℃,the speed 4 000 cm·min-1,the pressure 3 000 N,and finally,the pattern height of the hot-pressed light guide plate was improved from 2.0 μm to 4.0 μm.