表面贴装器件(SMD)回流焊可焊性试验研究

Research on Reflow Method Solderability Test for SMD Component

表面贴装器件被广泛应用于各种电子设备中,对于其可焊性的考核,与其它电子元器件有相同之处,又有所区别。该文浅析了表面贴装器件可焊性试验的测试方法,并通过控制变量,研究了不同的温度采集点设置、不同的基板材质选择和不同的预涂锡膏方式对表面贴装器件可焊性试验结果的影响。

Surface mounted devices are widely used in various electronic equipment,there is something different of the solderability test for SMD components.This paper analyzes the test method,and studies the influence of different temperature collection point settings,different substrate material selection and different pre-coated solder paste methods on the solderability test result by controlling the variables.