挤压温度对高纯铜组织演变规律的影响

Effect of extrusion temperature on microstructure evolution of high-purity copper

为了研究挤压温度对高纯铜微观组织和变形行为的影响规律,通过反向挤压方式对高纯铜进行不同挤压温度下的挤压实验并观察了其显微组织.结果表明,随着挤压温度的升高,高纯铜的晶粒尺寸增大.当挤压温度为650℃时,挤压棒材的平均晶粒尺寸为36μm;当挤压温度升至800℃时,挤压棒材的平均晶粒尺寸为51μm.随着变形量的增加,当挤压温度为650~700℃时,压余变形区的平均晶粒尺寸趋向于由60μm变为45μm;当挤压温度为750~800℃时,平均晶粒尺寸则趋向于由90μm变为75μm.800℃挤压变形后晶粒内部出现大量以Σ3特殊晶界为孪晶界的<111>60°退火孪晶.

In order to study the effect of extrusion temperature on the microstructures and deformation behavior of high-purity copper,extrusion experiments were carried out for high-purity copper at different extrusion temperatures by a reverse extrusion method,and the microstructures of high-purity copper were observed.The results show that the grain size of high-purity copper increases as the extrusion temperature increases.When the extrusion temperature is 650℃,the average grain size of extruded bar is 36μm.When the extrusion temperature raises to 800℃,the average grain size of extruded bar is 51μm.With the increase of deformation amount,when the extrusion temperature ranges from 650℃to 700℃,the average grain size of residual deformation part tends to change from 60μm to 45μm;when the extrusion temperature ranges from 750℃to 800℃,the average grain size of residual deformation part tends to change from 90μm to 75μm.After the extrusion deformation at 800℃,a large number of<111>60°annealing twins with specialΣ3 twinning boundaries can be observed.