聚氨酯丙烯酸酯复配油墨的热分解动力学研究

Study on Thermal Decomposition Kinetics of Polyurethane Acrylate Compound Ink

为评估用具有少量极性基团、低极性化学键的氟碳树脂与肪肪族聚氨酯丙烯酸酯进行复配制的油墨是否满足5G电路板要求,根据热重曲线所得的热分解动力学参数,用Flynn-Wall-Ozawa法计算油墨膜层失重率分别为10%,50%及70%时对应的表观活化能(作为标准表观活化能Ea0),再用Aehar-Brindley-Sharp-Wendworth微分法计算油墨热分解的各动力学模型,结合傅里叶变换红外光谱法,探究聚氨酯丙烯酸酯复配油墨的热分解机理。结果表明:氟碳树脂与脂肪族聚氨酯丙烯酸酯复配的油墨三段热降解过程Ea都相对较高,分别为50.27,102.53,190.07 kJ·mol^-1。结合对应的红外光谱曲线推测油墨膜层的热分解过程第一段(399~520 K)和第二段(520~657 K)为三维扩散,第三段(657~781 K)为三级化学反应。所制得的新型聚氨酯丙烯酸酯油墨Dk/Df较低,分解活化能较高,是5G比较好的选择。

To evaluate whether inks formulated with fluorocarbon resins and urethane acrylates with a small number of polar groups and low-polarity chemical bonds meet the requirements of 5G circuit boards,according to the thermogravimetric curve,we calculated the corresponding apparent activation energy as the standard apparent activation energy Ea0 using the Flynn-Wall-Ozawa method when the weight loss rate of the ink film was 10%,50%and 70%,respectively.Afterwards,the kinetic model of the ink thermal decomposition was determined by the Aehar-Brindley-Sharp-Wendworth method.Combined with Fourier transform infrared spectroscopy,the thermal decomposition mechanism of polyurethane acrylate composite ink was established.Our results show that the standard apparent activation energy Ea0 of the three-stage thermal degradation process for the ink compounded by acrylic fluorocarbon resin and polyurethane acrylate was relatively high,which was 50.27,102.53 and 190.07 kJ·mol^-1 respectively.According to the corresponding infrared spectrum curve,it can be inferred that the first(399-520 K),second(520-657 K)and third(657-781 K)stages of the thermal decomposition of the ink film are three-dimensional diffusion and three-stage chemical reactions.Based on our results,we can conclude that the new polyurethane acrylate ink prepared with the property of lower Dk/Df and higher decomposition activation energy is a better choice for 5G PCB.