摘要
2019年宏观经济增速放缓及传统半导体照明行业技术成熟度增加,全行业已经逐渐步入平稳发展期。同时,半导体照明行业市场环境竞争日益激烈,加上人们对LED产品品质要求的日益提高,加速半导体照明行业从"量"向"质"的变革,LED封装正逐渐向高附加值及高性能等新兴细分领域发展,如miniµ LED、健康照明、植物照明、景观照明、非视觉照明等市场关注度及份额不断增长,成为推动未来LED应用市场的强劲动力。与此同时,更高的市场需求驱动半导体照明产品革新和升级,因此LED封装技术亟需突破与创新,以适应新趋势的要求。
In 2019, with the sluggish growth of macro-economy and the increase in technical maturity of traditional semiconductor lighting industry, the whole LED industry has stepped into a stable development period. Meanwhile, the increasingly competitive market of semiconductor lighting industry together with the growing demand for LED product quality accelerates the transformation of semiconductor products from "quantity" to "quality".Thus, LED packaging is gradually shifting to the emerging sectors including high value-added and high-performance products such as mini & micro LED display, healthy lighting, plant lighting, landscape lighting and non-visual lighting. They are attracting huge attention and an increasing market share,which become a strong driving force for the future LED market.In addition, the higher market demand drives the innovation and upgrade of semiconductor lighting products. Therefore, LED packaging field is in urgent need of a technical breakthrough and innovation to suit the demand of new trend in technology.
作者
章金惠
谭孟苹
高晓宇
袁毅凯
李程
ZHANG Jinhui;TAN Mengping;GAO Xiaoyu;YUAN Yikai;LI Cheng(Foshan NationStar Optoelectronics Co.,Ltd.,Foshan 528000,China)
出处
《中国照明电器》
2020年第5期1-6,共6页
China Light & Lighting