超薄电镀金刚石切割片的研究状况

Research progress of ultrathin electroplated diamond chips

超薄电镀金刚石切割片具有加工精度高、切缝窄、效率高、质量好的优势,在硬脆材料及精密器件的精密切割加工中具有广泛的应用。近年来,随着我国人工智能以及5G信息产业的快速发展,其核心部件——芯片产业受到越来越多的重视。在芯片的制备流程中,超薄电镀金刚石切割片发挥了重要作用。文章重点介绍了国内超薄电镀金刚石切割片的研究状况,并与国外产品进行了简单对照,提出了存在的一些不足,以期为超薄电镀金刚石切割片的研究提供参考。

Ultra-thin electroplated diamond cutting blade are widely used in the precision cutting of hard and brittle materials and precision devices due to the advantages of high machining accuracy,narrow cutting seam,high efficiency,and good quality.In recent years,with the rapid development of artificial intelligence and 5G information industry in China,the chips,its core component,has been paid more and more attention.In the process of chip preparation,ultra-thin electroplated diamond cutting blade plays an important role.In this paper,the research status of ultra-thin electroplated diamond cutting blade in China was introduced,andsome shortcomings were put forward by comparison with foreign products,which provided a reference for the research of ultra-thin electroplated diamond cutting blades.