如何通过板级接地设计解决电磁兼容问题

How to Solve the Problem of EMC Through Board Level Grounding Design

接地是电子电气产品处理电磁兼容EMC(Electromagnetic Compatibility)问题的常用基础手段,通过对地定义和地设计“初心”的重新认识和深刻理解,并根据天磁场天线理论中两种天线模型展开原理分析,得出在板级EMC设计中接地的两个重要影响因素:接地地阻抗及地回路面积,最后在理论指导下解决PCB设计实践过程中的一些常见EMC问题。

Grounding is electronic electrical products processing Electromagnetic Compatibility EMC(Electromagnetic Compatibility)problem,the common methods based on"beginner's mind"to define and design the recognition and understanding,and according to the days of two antenna model in the theory of magnetic field antenna principle analysis,it is concluded that in board EMC in the design of two important factors:the influence of ground to ground impedance and circuit area,finally,in under the guidance of the theory to solve at board level some common EMC problems in the process of PCB design practice.