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某雷达密闭高频箱热仿真分析及优化设计

Thermal Simulation Analysis and Optimization Design of Sealed High Frequency Box of a Radar
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摘要 为了有效保护高频箱内电子设备并将其产生的热量有效散出高频箱,文中对高频箱进行了密封与散热设计。在高频箱密封腔中间设计散热风道,风道将密封腔体分成上、下密封腔体,上、下密封腔体内的热量通过传导传到散热翅片上,在密封腔隔板上设计翅片过孔,散热翅片通过该过孔伸入风道内,风道内的风扇将翅片上的热量吹出风道。在风道内加导风板,通过热仿真分析,优化导风板位置、散热翅片厚度和散热翅片间距。经过优化改进,高频箱的最高温度降低了8.9℃,从而提高了高频箱的散热效率。设计的高频箱可为其他产品解决防护与散热这一技术问题提供有益的参考。 In order to effectively protect the electronic equipment in the high frequency box and effectively disperse the heat generated by it out of the high frequency box,sealing and heat dissipation design for the high frequency box is carried out in this paper.A cooling duct is designed in the middle of the sealed chamber of the high frequency box.The duct divides the sealed chamber into upper and lower sealed chambers.Heat in the upper and lower sealed chambers is transmitted to the radiator fins through conduction.The through-holes for fins are designed on the sealed chamber baffle.The fins extend into the duct through the through-holes.The fans in the duct blow the heat from the fins out of the duct.A wind guide plate is added to the duct.The position of the guide plate,the fin thickness and the fin spacing are optimized by thermal simulation analysis.After optimization and improvement,the highest temperature of the high frequency box is reduced by 8.9℃,thus the heat dissipation effect of the high frequency box is improved.This high frequency box can provide useful reference for other products to solve the protection and heat dissipation problem.
作者 潘忠堂 PAN Zhongtang(Nanjing NRIET Industrial Co.,Ltd.,Nanjing 211106,China)
出处 《电子机械工程》 2020年第3期14-17,共4页 Electro-Mechanical Engineering
关键词 密闭高频箱 结构设计 热仿真 优化设计 sealed high frequency box structural design thermal simulation optimization design
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