数模复合印制电路微波组件焊接工艺研究

Research on Soldering Process for Microwave Modules Based on Composite PCB

高低频复合印制电路微波组件以其高密度、多功能、轻量化、低成本等特点被广泛应用。针对复合印制电路板与金属壳体之间的焊接工艺问题,主要从金属壳体材料选择、复合基板翘曲优化、焊料形态选择等方面展开分析讨论,对提高数模复合基板微波组件焊接质量具有重要指导意义。

The microwave components based on composite printed circuit have been widely used for their high integrated density,multifunction,lightweight and low cost.For the soldering process between the composite boards and the metallic cavity,the select of cavity material,boards warping and solder form on the soldering quality are discussed,which could be helpful for improving the assembly quality of micro modules on composite substrate.