大尺寸高铅凸点倒扣焊芯片的焊接过程控制

Soldering Process Control of Large Size FC with High Lead Bump

新一代航天工程、战略武器装备对电子系统提出了高性能、智能化、小型化、轻质化和高可靠的迫切需求,推动了系统级封装(SiP)的快速发展。微组装技术方面,在传统基于裸芯片堆叠、引线键合组装技术的基础上,基于TSV硅转接板的芯片级微凸点倒扣焊技术得到快速发展,该技术大大增加了输入/输出端的数目,可提供更短的引线、更小的电感、更高的频率、更好的噪声控制、更高的互连密度、更小的器件外形以及更低的器件安装高度。针对芯片级倒扣焊的工艺方法和可靠性研究已成为高性能SiP模块发展的重点研究方向。结合一款航天SiP模块实际应用需求,针对大尺寸高铅凸点倒扣焊芯片与SnAg凸台TSV硅基板结构,通过不同倒扣焊方式过程控制及可靠性影响进行分析研究,为高性能航天电子产品的倒扣焊技术研究提供思路。

The new generation of aerospace engineering and strategic weapons equipment put forward the urgent demand of high performance,intelligence,miniaturization,lightweight and high reliability of electronic systems,which promotes the rapid development of SiP.In terms of micro assembly technology,the soldering technology of chip level FC with micro bump based on TSV silicon adapter board has developed rapidly,which greatly increases the number of I/O terminals,and provides shorter leads,smaller inductors,higher frequency,better noise control,higher interconnection density,smaller device shape and lower device installation height.The process and reliability of chip level FC soldering has become the key research direction of high performance SiP.Combined with the practical application requirements of an aerospace SIP,the process control and reliability influence of different FC soldering methods for large size chip with high lead bump and TSV with SnAg cylindrical bump are analyzed and studied,so as to provide new thought for the research on FC technology of high performance aerospace electronic products.