期刊文献+

功能高分子材料在柔性电子领域研究进展 被引量:9

Research progress in developing functional polymers for flexible electronics
下载PDF
导出
摘要 柔性电子是基于柔性有机/无机功能材料、柔性/可延展基底并结合相应加工工艺得到的新型电子器件.与传统电子器件刚且硬的缺陷相比,柔性电子优秀的力学性能(柔性化和可拉伸等)使其更加适用于可穿戴电子、人机交互、软体机器人等尖端电子领域.自柔性电子起始阶段,高分子材料就被视为实现柔性电子技术走向应用的关键材料,例如柔性高分子基底材料、高分子界面改性材料、柔性高分子功能材料等.借助于高分子材料的优秀性能,半导体技术突破了传统材料的限制,实现了电子器件的柔性化,而且极大地拓展了柔性电子在生物医学、柔性显示屏、能量存储与转换器件以及人机交互等领域的应用.然而随着柔性电子技术的不断发展,现有的技术水平已经不能满足应用领域的苛刻需求,亟需在功能材料研究上获得突破.目前,研发用于柔性电子的新型功能高分子材料被视为解决这一问题的突破点之一.因此,本文基于本课题组的相关工作,综述了近期功能高分子材料在柔性电子领域的相关研究进展,基于柔性电子器件的组成角度以及加工工艺角度,从柔性电子中的三种关键材料(柔性基底材料、界面改性材料、柔性功能材料)出发,分析功能高分子材料在柔性电子领域的研究现状以及发展前景. As an emerging technology,flexible electronics is fabricated by integrating flexible organic/inorganic functional materials and flexible substrates using unconventional manufacturing techniques.Compared to conventional electronics,flexible electronics are more compatible for advanced applications such as wearable electronics,human-machine interfaces and soft robotics due to their exceptional mechanical performance.Soft polymers play a crucial role in fabricating flexible electronics.They can be widely used as flexible substrates,functional components,and interfacial modification materials.In certain cases,the intrinsic properties of functional polymers determine the ultimate performance or specific applications of flexible electronics were summarized.In this paper,recent progress in developing functional polymers for flexible electronics was summarized.Based on the essential roles of polymers that can serve in fabricating flexible electronics,a detailed discussion was given on the design and synthesis of polymer materials for use as flexible substrates,interfacial modification materials,and flexible functional components.In addition,prospects on developing functional polymer materials for future developments of flexible electronics were also provided.
作者 王志勇 汪韬 庄梦迪 徐航勋 WANG Zhiyong;WANG Tao;ZHUANG Mengdi;XU Hangxun(Department of Polymer Science and Engineering,CAS Key Laboratory of Soft Matter Chemistry, Hefei National Laboratory for Physical Sciences at the Microscale,University of Science and Technology of China, Hefei 230026, China)
出处 《中国科学技术大学学报》 CAS CSCD 北大核心 2019年第11期878-891,共14页 JUSTC
基金 国家重点基础研究发展规划(2015CB351903) 国家自然科学基金(21875235)资助.
关键词 柔性电子 功能高分子材料 柔性基底材料 界面改性 自修复 flexible electronics functional polymer material flexible substrate interface engineering self-healing
  • 相关文献

参考文献1

二级参考文献2

共引文献1

同被引文献68

引证文献9

二级引证文献10

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部