挠性基板光电互联结构的热应力可靠性研究

Study on Reliability of Photoelectric Structure in Flexible Printed Circuit Board under Thermal Stress

为了研究挠性光电互联结构在实际工程应用中的可靠性,建立了埋入光纤挠性基板光电互联结构有限元模型,根据光器件Telcordia GR-468标准加载热循环试验条件,对光电互联结构中的焊点应力、光纤应力和光电耦合效率进行仿真分析。热-结构仿真结果表明,焊点和光纤的最大等效应力均在安全范围内,光电耦合产生的最大损耗为0.7 dB,光电传输未受到显著影响,可以判定挠性光电互联结构在标准热循环作用下能够保证光电传输的稳定性。

In order to study the reliability of the flexible optoelectronic interconnect structure in practical engineering applications, a finite element model of the optoelectronic interconnect structure with optical fiber embedded in flexible substrate is established. According to the optical device standard Telcordia GR-468, thermal cycle is loaded. The solder joint stress, fiber stress and optocoupler efficiency is analyzed in the optoelectronic interconnect structure. The results show that the maximum equivalent stress of the solder joint and the optical fiber is in the safe range under the thermal-structure analysis. The maximum photoelectric coupling loss is 0.7 dB, which indicates that the effect of photoelectric transmission is not significant. It can be determined that the photoelectric interconnect structure in flexible printed circuit board can ensure the stability of photoelectric transmission under the load of thermal cycle.