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CMP抛光头分区自动压力校准方法的研究与实现

Research and Application of CMP Polish Head Zone Pressure Auto Calibration Method
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摘要 针对化学机械抛光(CMP)抛光头分区压力控制过程中存在的加载压力与反馈压力不一致、人工校准效率低、操作易出错等影响抛光工艺效果的问题,提出一种基于高精度压力检测仪的抛光头分区自动压力校准方法,并依据该方法,基于模型-视图-控制器(MVC)架构实现自动压力校准程序。经生产验证,采用该方法可提升工作效率,减少校准误差,提高压力校准精度。 In the CMP(Chemical Mechanical Polishing)head zone back pressure control progress,there exists problems such as there are biases between set pressure and feedback pressure,manual work in zone pressure calibration is low in efficiency and often cause various operation errors.All these problems may lead to negative effects to the polishing result.In order to solve these problems,we proposed a method based on high precision pressure detector to auto calibrate head zone pressure and achieved a program base on MVC(Model-View-Controller)framework.Through production verification,this method proved can improve work efficiency,reduce calibration errors and improve pressure calibration accuracy.
作者 贾若雨 白琨 孟晓云 JIA Ruoyu;BAI Kun;MENG Xiaoyun(Beijing Semicore Microelectronics Equipment Co.,Ltd.,Beijing 100176,China)
出处 《电子工业专用设备》 2020年第4期47-49,共3页 Equipment for Electronic Products Manufacturing
关键词 化学机械抛光 自动压力校准 高精度压力检测仪 CMP(Chemical mechanical polishing) Auto pressure calibration High precision pressure detector
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