摘要
针对某无裂纹电镀铬产品出现裂纹的问题,采用电感耦合等离子体质谱法(ICP-MS)和离子色谱法(IC)分析了问题镀液的杂质含量,并进行了一系列的实验研究。结果表明,镀液中Cu^2+的质量浓度高达666.0 mg/L,电镀过程中铜件掉入镀液,并与镀液中六价铬反应导致有三价铬生成是本次故障的主要原因,给出了解决和预防措施。
As for the problem of cracks formed in crack-free chromium-electroplated products,the contents of different impurities in the failed electroplating bath were analyzed by inductively coupled plasma mass spectrometry(ICP-MS)and ion chromatography,and some experiments were conducted.It was found that the mass concentration of Cu^2+was up to 666.0 mg/L.The problem was mainly caused by the fall of copper parts into the bath which reacted with hexavalent chromium,forming trivalent chromium.Some countermeasures and prevention measures were given.
作者
周科
娄霞
李智
温青妮
赵强
闫康平
ZHOU Ke;LOU Xia;LI Zhi;WEN Qingni;ZHAO Qiang;YAN Kangping(State Key Laboratory for Long-life High-temperature Materials,Deyang 618402,China;不详)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2020年第14期901-904,共4页
Electroplating & Finishing
基金
国家自然科学基金(51702027)。
关键词
六价铬电镀
裂纹
铜离子
三价铬
故障排除
hexavalent chromium electroplating
crack
copper ion
trivalent chromium
troubleshooting