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恒定加速度试验中陶瓷密封器件所受不良应力

Bad Stress on Ceramic Sealing Devices in Constant Acceleration Test
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摘要 筛选试验的目的是选择具有一定特性的产品或剔除掉早期失效的产品,在恒定加速度试验中,常常因为试验设计不当、试验方法选择不当或试验夹具设计不当等因素,在试验过程中引入不良应力,导致器件损坏。针对此问题搭建恒定加速度仿真系统,结合有限元仿真分析方法,分别研究了三种常见的恒定加速度试验方法,即埋砂法、磁贴法和夹具法在试验过程中引入的不良应力的形式和危害性,分别指出了损伤机理。对较为恶劣的工况进行优化改进,优化后,不良应力明显下降,避免了夹具法试验对金锡焊料环的损伤。实验分析表明,在实际恒定加速度试验时,根据外壳尺寸特征选择合适的试验方法,可充分减小过程中引入的应力。 The purpose of screening test is to select products with certain characteristics or reject products with early failure. In constant acceleration test, bad stress is often introduced in the test process due to improper design of test, improper selection of test method or improper design of test fixture, which leads to device damage. In order to solve this problem, a constant acceleration simulation system is built.Combined with the finite element simulation analysis method, the forms and harmfulness of bad stress introduced by three common constant acceleration test methods, namely sand burying method, magnetic sticking method and fixture method, are studied, and the damage mechanism is pointed out respectively.The bad working conditions are optimized and improved. After optimization, the bad stress is obviously reduced without the damage of Au-Sn solder ring caused by fixture test. The experimental analysis shows that in the actual constant acceleration test, selecting the appropriate test method according to the size characteristics of the shell can fully reduce the stress introduced in the process.
作者 罗珏 赵鹤然 田爱民 刘庆川 李莉莹 LUO Jue;ZHAO Heran;TIAN Aimin;LIU Qingchuan;LI Liying(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110032,China;College of Information and Electrical Engineering,Shenyang Agricultural University,Shenyang 110086,China)
出处 《微处理机》 2020年第4期14-18,共5页 Microprocessors
基金 国防科工局技术基础科研项目资金资助(JSZL2017210B015)。
关键词 恒定加速度 筛选 可靠性 夹具 有限元 Constant acceleration Screening Reliability Fixture Finite element
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  • 1杜迎,朱卫良,吕栋,陆坚,宫建华.恒定加速度试验的研究[J].电子产品可靠性与环境试验,2004,22(3):67-71. 被引量:7
  • 2张国华,杜迎.恒定加速度的试验方法探讨[J].半导体技术,2006,31(5):346-349. 被引量:5
  • 3全国化工设备设计中心站机泵技术委员会.工业离心机选用手册.北京:化学工业出版社,1997.
  • 4电工电子产品环境试验国家标准汇编.北京:中国标准出版社,1999.
  • 5GJB548A-96.微电子器件试验方法和程序[S].[S].,..
  • 6微电子器件试验方法和程序[M].2005.
  • 7姜涛.AnsysWorkbench培训手册[Z].2011.
  • 8SPTimoshenko.弹性理论[M].北京:清华大学出版社,2007.
  • 9IWASAKI, A1CHI. NTK HTCC Package General Design Guide [Z]. 2008.
  • 10R R Tummala,Eugene J Rymaszewski,etc,中国电子学会电子封装专业委员会.电子封装丛书编辑委员会.微电子封装手册[M].北京:电子工业出版社,2001.

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