摘要
为解决弹载电子设备短时高功耗运行可能引起的元器件急剧温升进而导致失效问题,文章首先研究了几种相变热沉的设计方法和工艺路径,通过仿真对比证明碳基骨架‒特种石蜡复合相变热沉质轻且散热性能优越。然后,针对新研高热耗模块,对膨胀石墨‒特种石蜡复合相变热沉进行精细化设计,制作样件,并通过仿真对比验证其散热性能满足要求,同时分析了实验测试结果和仿真结果的差异及原因,研究结果可为严酷条件下应用相变材料进行热设计和热管理提供参考。
The missile-borne electronic equipment may experience an acute temperature rise in the shorttime high power consumption mode,with the risk of failure.In order to solve this problem,some kinds of PCM heat sinks are studied by different design methods and in different processing paths.Through thermal simulation,the carbon-based special paraffin composite PCM is shown to be lighter and with better heat dissipating capability.Then,a graphite-based special paraffin composite PCM is precisely designed and adopted to a newlydeveloped high heat flux module.The thermal simulation results show that the heat dissipation performance can meet the technical requirements.After that,a thermal test under the same condition is conducted,and the results are compared with the simulation results.The method and the results of this paper can be used in the thermal design and the thermal management using the PCM heat sink under rigorous conditions.
作者
林佳
刘云峰
尹本浩
谭继勇
陈显才
LIN Jia;LIU Yunfeng;YIN Benhao;TAN Jiyong;CHEN Xiancai(The 29th Research Institute of China Electronics Technology Group Corporation,Chengdu 610000,China;The 4th Military Deputy Office of Rocket Force Equipment Department in Chengdu Area,Chengdu 610052,China)
出处
《航天器环境工程》
2020年第4期390-396,共7页
Spacecraft Environment Engineering
关键词
弹载电子设备
复合相变材料
相变热沉
仿真分析
实验测试
missile-borne electronic equipment
composite PCM
PCM heat sink
simulation analysis
experimental test