柔弹性复合薄膜的制备及其力电性能测试

Fabrication and Mechanical/electrical Property Testing of Elastomeric Composite Films

采用自组装方法合成了三种纳米金颗粒(AuNPs)/聚合物薄膜材料,即AuNPs/PI(聚酰亚胺)、AuNPs/PE(聚乙烯)和AuNPs/PU(聚氨酯),并通过工艺实验、扫描形貌分析及力电性能测试深入研究了该类材料“制备工艺-微/纳观结构-整体性能”的相互关系及基体材料对上述关系的影响。着重探讨了“seeding”时间对纳米金颗粒分布、含量的影响;金颗粒含量对材料机械性能的影响及复合材料的导电渗滤特性。研究结果表明,增加“seeding”时间可增大金颗粒尺寸,提升材料的金颗粒体积含量。在相同制备工艺下,PI基体表现出吸附纳米金颗粒的最佳效果;尤其当金颗粒含量增加至某一阈值时材料导电率数量级上升,其中AuNPs/PI获得了最高导电率2.5S/cm。另一方面,金颗粒含量的提高将降低复合材料薄膜的柔弹性。

Gold nanoparticle(AuNP)-polymer composites are fabricated based on self-assembly method with various combinations of technological parameters.Subsequently,SEM analyses and electrical/mechanical property tests were carried out to investigate the correlation among processing parameters,the material structures and the overall material properties.Emphases are placed on the effect of seeding time on the distribution and volume fraction(VF)of AuNPs,the VF effect on the mechanical properties and the percolation behavior of the composites.It is found that the size and VF of AuNPs increase with growing seeding time,and at given seeding time,polyimide can absorb more AuNPs than other polymer matrices used.In addition,the highest conductivity 2.5S/cm is achieved for the composite with polyimide matrix.It is expected that these results can provide guidance for the optimum design and fabrication of the composites to achieve desirable combination of material properties.