扇出型封装发展、挑战和机遇

Development,Challenges and Opportunities of Fan-out Packaging

扇出型封装在集成电路封装中受到越来越多的关注,近年来取得了长足进步,也被认为是延续和超越摩尔定律的关键技术方案。根据扇出型封装的发展趋势,从当前扇出型封装几种重要的技术路线、技术应用、未来挑战和机遇方面进行了系统梳理。详细对比分析了圆片级树脂型扇出封装、硅基晶圆级扇出型封装和面板级扇出型封装技术方法和特点,阐述了半导体设备和材料对扇出型封装的影响和相互协同发展。最后,从技术、应用和市场战略方面分析了扇出型封装存在的挑战和机遇。

Fan-out packaging has attracted more and more attention in IC packaging,and has also made a great progress in recent years.It is also considered to be a key technical solution to support More-than-Moore law.In this paper,three kinds of fan-out packaging routes,applications,challenges and opportunities were introduced.Process flows and characteristics of eWLB,eSiFO and PLP packaging technologies were detailed analyzed.Meanwhile,the relationship between improvement of semiconductor equipment as well as materials and development of fan-out packaging was explained.Finally,the challenges and opportunities of fan-out packaging are analyzed from the aspects of technology,application and market strategy.