等温与非等温DSC法研究环氧树脂的固化动力学

Study on the curing kinetics of epoxy resin by isothermal and non-isothermal DSC

采用等温和非等温DSC法对双酚A环氧树脂(DGEBA)/4,4′-二氨基二苯砜(DDS)体系的固化过程进行了研究。通过非等温DSC曲线确定其固化工艺温度,并通过Kissinger方程和Crane方程的线性拟合得到非等温DSC条件下的动力学参数,由动力学参数得到的固化度与时间的理论关系曲线表明其固化机理非n级机理而是自催化机理。等温DSC实验测试曲线证明了DGEBA/DDS的固化过程确实符合自催化机理的特征。两种方法测试结果表明不同测试条件对环氧树脂的固化反应影响不同。

The curing process of bisphenol A epoxy resin(DGEBA)/4,4′-diaminodiphenyl sulfone(DDS)system was studied by isothermal and non-isothermal DSC. The curing temperature was determined by non-isothermal DSC curve,and the dynamic parameters under non-isothermal DSC conditions were obtained by linear fitting of Kissinger equation and Crane equation. The theoretical relationship curve of curing degree and time obtained by using the kinetic parameters showed that the curing mechanism was not an n order mechanism but an autocatalytic mechanism. The isothermal DSC experimental test curve proved that the curing process of DGEBA/DDS really conformed to the characteristics of autocatalytic mechanism. The test results of the two methods showed that different test conditions had different effects on the curing reaction of the epoxy resin.