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高压直流故障电流限制器热接触分析

Analysis of Thermal Contact of High Voltage Direct Current Fault Current Limiter
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摘要 高压直流故障电流限制器HVDCFCL(High Voltage Direct Current Fault Current Limiter)在环境特殊的先进实验超导托卡马克EAST(Experimental Advanced Superconducting Tokamak)核聚变实验装置,对电气故障敏感的离子源系统上起到了有力的保护作用。HVDCFCL装置在离子源长脉冲工作状态下的散热性能是系统可靠性的一个重要因素,基于简化装置的铁芯叠片层进行热接触分析,利用ANSYS接触单元模拟接触热阻,提出一种将接触热阻引入散热性能分析过程方法。结果表明离子源长脉冲运行状态下的HVDCFCL装置,在接触热阻的作用下,接触界面的热流通量发生明显变化,而接触热阻的大小则与热流方向、材料的热导率相关,此外,由于受接触热阻的影响,在铁芯叠片的内侧接触面上温度变化明显。 High Voltage Direct Current Fault Current limiter(HVDCFCL)plays a powerful protective role in the system of the experimental advanced superconducting TOKAMAK(EAST),especially in the ion source system susceptible to the effect of electrical failure.The heat-dissipating performance of the device in the long-pulse working state of ion source is an important factor accounting for the system reliability.Based on a simplified core disk,this paper performed a thermal contact analysis,utilized ANSYS contact element to simulate the contact thermal resistance,and proposed a method introducing contact thermal resistance into heat dissipation analysis.The results suggest in the device containing long-pulse ion source,a significant change occurs in the heat flux on contact interface under the effect of contact thermal resistance,which is related with the direction of heat flux and the heat conductivity of the material.Besides,the temperature of inner side interface of core lamination changes dramatically due to the effect of contact thermal resistance.
作者 谢飞 金环 王超 汪献伟 XIE Fei;JIN Huan;WANG Chao;WANG Xianwei(School of Intelligent Manufacturing,Shunde Polytechnic,Foshan Guangdong 528333,China;Institute of Plasma Physics,Chinese Academy of Sciences,Hefei Anhui 230031,China;School of Mechanical Engineering,Jiangsu University of Technology,Changzhou Jiangsu 213001,China)
出处 《顺德职业技术学院学报》 2020年第3期1-5,共5页 Journal of Shunde Polytechnic
基金 广东省自然科学基金专项(2017A030310640) 广东省数字化工厂工程技术研究中心专项(2018-KJZX014)。
关键词 先进实验超导托卡马克 高压直流故障电流限制器 ANSYS 铁芯叠片 热分析 接触热阻 EAST HVDCFCL ANSYS core lamination thermal analysis thermal contact resistance
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