复合柔性电子变形失配数字图像相关研究

Digital image correlation research on deformation mismatch of composite flexible electronics

为了定量表征复合柔性电子相邻层变形失配程度,设计了一种基于数字图像相关(digital image correlation,DIC)的实验系统和变形失配评价方法。首先制备复合柔性电子样品,通过平移实验对实验系统进行验证,其次在不同温度下对样品进行单轴拉伸,计算Von Mises应变,最后通过定义图案化应变波动指数P来对变形失配程度进行表征。实验结果表明,实验系统平移误差在1%之内,满足变形测量要求。50℃下样品被拉伸2 mm,Von Mises应变最大值与最小值相差约65%,样品呈现出应变大小不均匀但应变分布均匀的变形失配。同一拉伸条件下,变形失配程度在25℃~75℃变化较小,100℃下变化明显,增加了近60%,该方法有效的表征了柔性电子变形失配程度。

In order to quantitatively characterize the degree of deformation mismatch of adjacent layers of composite flexible electronics,an experimental system based on digital image correlation(DIC)and a method of evaluating deformation mismatch are designed.First,a composite flexible electronic sample was prepared,and the experimental system was verified through translation experiments.Second,the sample was uniaxially stretched at different temperatures and the Von Mises strain was calculated.Finally,the degree of deformation mismatch was Characterized by defining the patterned strain fluctuation index P.The experimental results showed that the translation error of the experimental system was within 1%,which meets the requirements of deformation measurement.The sample was stretched by 2 mm at 50℃,and the maximum and minimum strains of Von Mises differed by about 65%.The sample showed deformation mismatch with uneven strain value but uniform strain distribution.Under the same tensile conditions,the degree of deformation mismatch changed little from 25℃to 75℃,and it changed significantly at 100℃,the increment was about 60%.This method effectively characterizes the degree of flexible electronic deformation mismatch.