银粉活化镀铜、界面结构与性能

Electroless copper plating assisted by functionalized Ag powder:interface structure and properties

将经硅烷偶联剂KH-560改性后的银粉均匀涂覆到预固化的环氧树脂表面,银粉经过处理后可作为活性中心活化化学镀铜,得到致密、导电性高、结合力强的铜镀层。采用傅里叶变换红外光谱仪(F T-IR)、X射线光电子能谱仪(XPS)、扫描电子显微镜(SEM)、X射线测厚仪、能谱仪(EDS)、电阻测试仪等手段系统研究了KH-560改性后银粉的化学态、化学可镀性、银粉界面层的结构与厚度、镀层与树脂之间的结合力以及镀层的导电性,结果表明:K H-560可以成功改性银粉,银粉表面的硅烷偶联剂膜会影响银催化镀铜的效果,但可以通过水解去除偶联剂膜从而暴露出银粉达到催化化学镀铜的目的。当KH-560用量(占银粉质量分数)为4%时,镀层与树脂之间的结合力最大为2.27 MPa,较未用K H-560改性银粉镀层的结合力提升了25.4%;铜镀层均匀致密,电导率约为3.15×10^7 S/m。

Ag powder modified by a silane coupling agent KH-560 has been well-distributed on the surface of a pre-cured epoxy resin.The Ag powder can serve as a catalytic center for electroless copper plating after hydrolysis.The resulting dense Cu coating has high conductivity and a robust interface.FT-IR spectroscopy,X-ray photoelectron spectroscopy(XPS),SEM,X-ray thickness detector,EDS and resistance testing were used to study the chemical states of Ag powders modified by KH-560,the interface structure and thickness of the Ag powder layer,the electroless plating ability of Ag,the pull strength between the Cu coating and resin,and the conductivity of the Cu coating.The results showed that Ag powder can be modified by KH-560,and growth of the silane coupling agent on the Ag powder hinders the electroless plating.Significantly,the coupling agent film could be hydrolyzed.After the removal of K H-560,a smooth and compact Cu coating was obtained.When the content of KH-560 was 4%of the weight of Ag powder,the maximum pull strength between the Cu coating and resin was 2.27 MPa,which is 25.4%higher than that obtained without K H-560.The conductivity of the Cu coating was about 3.15×10^7 S/m.