基于微通道热管和天空辐射制冷技术新型散热方式的试验研究

EXPERIMENTAL STUDY ON NOVEL HEAT DISSIPATION BASED ON SKY RADIATIVE COOLING AND MICRO-CHANNEL HEAT PIPE

为防止电子元件因发热造成的异常运行,设计一套集微槽道热管、天空辐射制冷技术为一体新型的散热系统。为测试该系统的散热效果,制作3种不同类型的辐射板,分别为铝板表面涂覆丙烯酸树脂的辐射板(A)、铝板表面贴有聚四氟乙烯薄膜的辐射板(B)和裸铝板的辐射板(C)。经过2 d的试验测试,结果表明:1)辐射板A和B的全波长半球向发射比分别在0.9和0.7以上,其中在大气窗口波段内的发射比分别为0.916和0.842;2)采用辐射板A散热的电子元件平均温度比采用辐射板B和C散热分别低0.9和5.1℃;3)辐射板A和B的等效辐射散热系数分别为4^8、4.0^8.0 W/(m^2·K)和3.5^6.5 W/(m^2·K)。因此,所设计的散热系统可较好地提高电子元件的散热能力,减少一定的散热能耗。

In order to prevent the abnormal running of electronic components caused by heat dissipation,a novel type of heat dissipation method combining micro-channel heat pipe(MHP)and sky radiative cooling(RC)was proposed.To test the heat dissipation effect of this method,three different types of radiative cooling plates were made,including RC plates(A)coated with acrylic resin,RC plate(B)sticked with the PTFE film and a bare aluminum plate RC plate(C).After two consecutive days of experimental testing,the results showed that:1)the hemispheric emissivity of the RC plate A and B are respectively above 0.9 and 0.7,respectirely,and the emissivity of the atmospheric window band are 0.916 and0.842,respectively;2)the average temperature of the electronic components using the RC plate A was respectively 0.9 and 5.1℃lower than that of the RC plates B and C;3)the equivalent heat dissipation coefficients of RC plates A and B were 4.0-8.0 W/(m^2·K)and 3.5-6.5 W/(m^2·K),respectively.Therefore,the designed cooling system could improve the cooling capacity of electronic components and reduce energy consumption for its heat dissipation.