碳纳米管/铜复合薄膜的制备及表征

Preparation and Characterization of Carbon Nanotube/Copper Composite Films

通过有机溶剂对多壁碳纳米管薄膜进行溶剂热及有机电镀处理,制备了高导电性能和载流能力的Cu/MWCNTs复合薄膜,其中铜晶体均匀的分布在MWCNTs内部及外部,且复合材料的密度仅为铜的1/4。在碳纳米管薄膜的电学性能提高下进一步分析了溶剂热、不同电流密度、退火还原及热压对碳纳米管电学性能的影响。结果表明:溶液浓度为7.5 mmol/L电流密度为2 mA/cm^2,沉积时间2 h,水浴温度为26℃,复合薄膜的性能达到最佳;退火温度为300℃,以及在1000℃和2.6 MPa压力下热压,复合薄膜的电导率及载流性能达到最佳,分别为2.5×10^7 S/m和1×105 A/cm^2。

Cu/MWCNTs composite films with high conductivity and current carrying capacity were prepared by organic solvent heating and organic electroplating of multi-walled carbon nanotube films.Copper crystals were uniformly distributed inside and outside MWCNTs,and the density of the composite materials was only 1/4 that of copper.The effects of solvent heat,different current density,annealing and reduction,and heat pressure on the electrical properties of carbon nanotubes were analyzed.The results showed that:the solution concentration was 7.5 mmol/L,the current density was 2 mA/cm^2,the deposition time was 2 h,the water bath temperature was 26℃,the performance of the composite film reached the best.At the annealing temperature of 300℃ and under the pressure of 1000℃ and 2.6 MPa,the conductivity and current-carrying performance of the composite film reached the best,which were 2.5×10^7 S/m and 1×10^5A/cm^2,respectively.The carbon nanotubes were embedded with copper seeds by solvent heat treatment,which laid a foundation for the subsequent organic deposition of copper.