真空汽相焊接在微波组件装配中的应用

Application of Vacuum Soldering in Microwave Module Assembly

针对某型弹载砖式有源相控阵天线微波组件频率高、通道多、双面组装的设计需求,通过工艺总体策划,采用激光精密加工、梯度阶梯焊组装、激光缝焊等先进制造技术,将真空汽相焊工艺运用于微波组件装配,优化砖式微波组件多通道双面焊接流程。装配完成的组件经X光检测与通电测试,其焊透率、气密性、接地性能等相比传统手工操作,均得到大幅提升。该工艺技术在保证组件满足天线性能、集成度以及可靠性的要求的同时,提高批量生产效率。

This paper proposed an assembly solution of a brick-type microwave T/R module according to the requirements of high frequency,multiple-channel and double-sided soldering.The assembly solution integrated a series of advanced manufacturing technologies including precise laser machining,gradient soldering,laser hermetic seal and innovatively,vacuum soldering was applied to optimize the entire assembly process of the module.X-ray and conduct test results show that the void ratio of solder joints,air-impermeability and the high frequency performance of all channels has been improved significantly,compared with manual assembly.Besides,this assembly meets the requirements of the Active Phased Array Antenna,such as high performance criteria,high integration,and high reliability,which leads to the high efficiency of batch production.