基于Moldflow的手机壳成形翘曲分析及优化设计

Warpage Analysis and Optimization Design of Mobile Phone Shell Based on Moldflow

薄壁注塑件制品生产过程中易产生翘曲变形,质量难以保证,致使模具设计过程复杂,开发周期长。运用Moldflow仿真软件,对ABS+PC材质的手机壳注塑过程产生的翘曲变形进行了分析。结果表明,收缩不均产生形变是产生翘曲变形的主要影响因素,熔体温度、注射压力、保压压力和保压时间等工艺参数是引起塑件收缩不均的主要原因。根据模流分析的结果优化工艺参数,可以进一步减小翘曲变形量,对于提高产品质量,缩短产品开发周期,具有较好的指导意义。

In the production process of thin-walled injection molded parts,warpage is easy to occur,and the quality is difficult to guarantee,which makes the mold design process complicated and the development cycle long.By using Moldflow simulation software,the warpage of ABS+PC mobile phone shell during injection molding was analyzed.The results show that the deformation caused by uneven shrinkage is the main influencing factor of warpage,and the main reasons are melt temperature,injection pressure,holding pressure and holding time.According to the results of the model flow analysis,the optimization of the process parameters can further reduce the warpage deformation,which has a good guiding significance for improving the product quality and shortening the product development cycle.