高多层厚铜大尺寸背板的制作

Manufacture of large size backplane with high multiple layers and thickness copper

在印制电路板生产制作过程中,高多层厚铜背板具有较高的技术要求。文章主要介绍一种30层厚铜板的制作难点和解决方案,为类似产品生产提供技术支持。

During the process of PCB,high lay count MLB with thick copper backplate has high technical requirements.This paper mainly introduces the difficulties and solutions of producing 30-layer thick copper plate to provide technical support for the production of similar products.