摘要
针对使用钨铜合金作为底座的可伐金属外壳进行了氢含量控制的研究。采用镀前一次烘烤350℃×48 h和镀后二次烘烤250℃×48 h的方式可将成品内部氢含量控制在0.2%以内。
The process for control of hydrogen content in Kovar alloy package with a W–Cu alloy cooling base was studied.The hydrogen content in the finished product could be controlled below 0.2%by first baking at 350℃for 48 h before electrolplating and secondary baking at 250℃for 48 h after electroplating.
作者
董一鸣
申忠科
敖冬飞
刘思栋
谢新根
DONG Yiming;SHEN Zhongke;AO Dongfei;LIU Sidong;XIE Xin’gen(Nanjing Electronic Devices Institute,Nanjing 210016,China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2020年第15期991-995,共5页
Electroplating & Finishing
关键词
钨铜合金底座
可伐合金
封装外壳
电镀
镍
金
烘烤
氢含量
tungsten–copper alloy base
Kovar alloy
package
electroplating
nickel
gold
baking
hydrogen content
