摘要
对于单板焊点的可靠性评价问题,目前主要借助有限元仿真技术与基于故障物理的PHM技术加以解决。限于单板整板焊点有限元建模与仿真分析的难度与工作量,相关研究中对焊点的有限元仿真与评价主要集中在器件级,而板级的有限元仿真中大多采用了器件的简化模型,实际的仿真规模并不大。通过对包含2.4万体的大型互联单板进行整板的有限元仿真分析与危险焊点的寿命评价,解决了大型互联单板整板的几何建模与有限元建模过程中众多的技术性问题,并提供了一套通用的建模流程与高质量网格的划分方法,显著地降低了因模型构建错误而导致分析失败的可能性,有助于提高有限元仿真分析的质量与效率。
At present,the reliability of single board solder joint is mainly solved by means of finite element simulation and PHM technology based on fault physics.Due to the difficulty and workload of finite element modeling and simulation analysis of single board joint,the finite element simulation and evaluation of solder joint in related research are mainly focused on the device level,while the simplified model of the device is mostly used in the finite element simulation of the plate level,and the actual simulation scale is not large.Through the finite element simulation analysis of the entire board and the life evaluation of the dangerous solder joints for the large-scale interconnected single board containing 24000 bodies,many technical problems in the geometric modeling and finite element modeling of the large interconnected board are solved,and a set of general modeling flow and high-quality grid division method is proposed,which significantly reduces the possibility of failure caused by model construction errors,and helps to improve the quality and efficiency of finite element simulation analysis.
作者
刘放飞
LIU Fangfei(CEPREI,Guangzhou 510610,China;Guangdong Province Key Laboratory of Electronic Information Products Reliability Technology,Guangzhou 510610,China;National Joint Engineering Research Center of Reliability Test and Analysis for Electronic Information Products,Guangzhou 510610,China)
出处
《电子产品可靠性与环境试验》
2020年第4期10-17,共8页
Electronic Product Reliability and Environmental Testing
关键词
焊点
有限元建模
仿真分析
寿命预测
网格划分
solder joint
finite element modeling
simulation analysis
life prediction
grid division
