高温烘烤对缓解硅铝材料氦气吸附程度影响研究

Research on the Effect of High Temperature Baking on Alleviating the Adsorption of Helium of Silicon Aluminum Material

为了有效地缓解铝硅材料表面的氦气吸附,保证微波器件密封试验的有效性,针对目前应用得最普遍的去除吸附氦气的方法——高温烘烤法,分析了其缓解氦气吸附的机理,基于Howl-Mann方程研究了高温烘烤对硅铝材料真实漏率的影响;同时分析了不同烘烤温度、不同烘烤时间对缓解硅铝材料表面氦气吸附程度的影响,为研制单位开展密封试验提供了指导,有助于提升国产微波器件封装的质量可靠性。

In order to effectively alleviate the adsorption of helium on the surface of aluminumsilicon materials and ensure the effectiveness of the microwave device sealing test,aiming at the most widely used method of removing absorbed helium——the high-temperature baking method,its mechanism of relieving helium absorption is analyzed at first.Then,based on the HowlMann equation,the effect of high temperature baking on the true leakage rate of siliconaluminum materials is analyzed,which provides guidance for development units to carry out sealing tests and is helpful for the improvement of the quality and reliability of domestic microwave device packaging.